Underfill导热胶_ASEC低温焊接底填胶39-ICH08
ASEC Underfill导热胶39-ICH08_适用于低温焊接封装。该胶水为平衡固化剂。有可能获得低CTE和低温度固化的特性。
Underfill导热胶_ASEC胶水39-ICH08特点：
Liquid state
Property Typical Value Test Condition
Chemical Epoxy (Black)
Specific Gravity 1.4 @25度
Thixotropic index 1.0 12s-1/120s-1
Viscosity 4.200 mPa·s Cone plate type, 120s-1
Cured state
Property Typical Value Test Condition
Tensile Modulus 4.6 Gpa 25度, DMA
Tg 120度 DMS
CTE α1/α2 39/105 ppm/度 TMA
Tensile shear strength 16 Mpa JIS K 6850
Volume resistivity 2.28 x 1015Ω·cm JIS K 6911
Surface resistivity 9.7 x 1015Ω JIS K 6911
Dielectric constant 3.08 1.0GHz
3.05 2.45GHz
Dielectric loss tangent 0.015 1.0GHz
0.015 2.45GHz
Underfill导热胶_ASEC低温焊接底填胶39-ICH08相关产品：
衡鹏供应
ASEC 39-ICH09_Underfill导热胶/散热胶/导热底填胶/散热底填胶/低温焊接底填胶/低温焊接底填胶/SnBi合金焊接底填胶/SnBiAg合金焊接Underfill胶水
